Basic Description
Specialty
¡ô Suitable for high density mounting.
¡ô Contrlbules to downsizing and lighter weight of application devices.
¡ô Raflow solderable.
¡ô Packaged with a 12mm wide embossed taping.
¡ô Suitable for high density mounting.
¡ô Contrlbules to downsizing and lighter weight of application devices.
¡ô Raflow solderable.
¡ô Packaged with a 12mm wide embossed taping.
Application
¡ô For operating various devices such as audio devices, video recorders, communication device, cameras and automotlve set that require lowprofile and lightweight design.
¡ô Mobile phone
¡ô For operating various devices such as audio devices, video recorders, communication device, cameras and automotlve set that require lowprofile and lightweight design.
¡ô Mobile phone
Product View
| Model | Operating Force | Operating orientation | Travel | Ratings(max) | (5mA 5V DC) | Contact Resistance | PCS |
|---|---|---|---|---|---|---|---|
| TS-C001 | 160gf |
Side Press |
0.25 | 50mA 12V DC | 5x104 | 100m¦¸ max | 1000 |
| 250gf | 3x104 |
Outside View
| Size | Installation Diagram And Circuit |
|---|---|
 |
 |
