Basic Description
Specialty
¡ô Improve mounting density of components on PC board.
¡ô Raflow solderabla.
¡ô Contacts are complataly sealed, enhanang rehability.
¡ô Packagad with a 12mm wide embossed taping.
¡ô Improve mounting density of components on PC board.
¡ô Raflow solderabla.
¡ô Contacts are complataly sealed, enhanang rehability.
¡ô Packagad with a 12mm wide embossed taping.
Application
¡ô For operating various mobile devices.
¡ô For operating various devices that require high density mounting such as mobile phones, communication devices, compact electronic devices.
¡ô For operating various mobile devices.
¡ô For operating various devices that require high density mounting such as mobile phones, communication devices, compact electronic devices.
Product View
| Model | Operating Force | Operating orientation | Travel | Ratings(max) | (5mA 5V DC) | Contact Resistance | PCS |
|---|---|---|---|---|---|---|---|
|
TS-B021
|
160gf |
Side Press |
0.2 | 50mA 12V DC | 5x104 | 100m¦¸ max | 1000 |
| 250gf | 3x104 |
Outside View
| Size | Installation Diagram And Circuit |
|---|---|
 |
 |
