Basic Description
Specialty
¡ô Improved component placement density on printed circuit boards.
¡ô Adapt to reflow soldering.
¡ô Sealed contact structure improves reliability.
¡ô The switch is packed with 12mm width braid.
¡ô Improved component placement density on printed circuit boards.
¡ô Adapt to reflow soldering.
¡ô Sealed contact structure improves reliability.
¡ô The switch is packed with 12mm width braid.
Application
¡ô Used to operate various mobile devices.
¡ô Used to operate various devices that require high-density installation, such as mobile phones, communication equipment, and small electronic devices.
¡ô Used to operate various mobile devices.
¡ô Used to operate various devices that require high-density installation, such as mobile phones, communication equipment, and small electronic devices.
Product View
| Model | Operating Force | Operating orientation | Travel | Ratings(max) | (5mA 5V DC) | Contact Resistance | PCS |
|---|---|---|---|---|---|---|---|
| TS-A001 | 160gf | Direct press | 0.2 | 50mA 12V DC | 5x104 | 100m¦¸ max | 1000 |
| 250gf | 3x104 |
Outside View
| Size | Installation Diagram And Circuit |
|---|---|
 |
 |
