Welding types of small micro switches
1. The manual welding of small microswitches has the advantage that it can accurately grasp the welding of each component, but the disadvantage is that it is too time-consuming and laborious.
2. Wave soldering of pins has the advantages of low price, time and labor saving. Disadvantages: with the components becoming smaller and smaller and the PCB becoming more and more dense, the possibility of bridging and short circuit between solder joints has increased.
3. Reflow soldering of patches. The advantage of this process is that the temperature is easy to control, oxidation can be avoided in the welding process, and the manufacturing cost is easier to control. The disadvantage of small microswitch is that solder edge collapse will also occur during welding heating. This situation occurs in preheating and main heating. When the preheating temperature is in the range of tens to 100, the solvent as one of the components of solder will reduce the viscosity and flow out. If the outflow trend is strong, the solder particles will be squeezed out of the gold containing particles outside the welding area at the same time, During melting, if it cannot return to the welding area, retained solder balls will also be formed.
Because of its small size, multiple gears, uniform driving force and good paragraph feeling, it is widely used in many fields such as household appliances. With the continuous improvement of people's living standards, the upgrading of these household appliances is faster and faster, and the number of them will be larger and larger, which is also the greatest potential direction for us to be optimistic about its development prospects.
1. The manual welding of small microswitches has the advantage that it can accurately grasp the welding of each component, but the disadvantage is that it is too time-consuming and laborious.
2. Wave soldering of pins has the advantages of low price, time and labor saving. Disadvantages: with the components becoming smaller and smaller and the PCB becoming more and more dense, the possibility of bridging and short circuit between solder joints has increased.
3. Reflow soldering of patches. The advantage of this process is that the temperature is easy to control, oxidation can be avoided in the welding process, and the manufacturing cost is easier to control. The disadvantage of small microswitch is that solder edge collapse will also occur during welding heating. This situation occurs in preheating and main heating. When the preheating temperature is in the range of tens to 100, the solvent as one of the components of solder will reduce the viscosity and flow out. If the outflow trend is strong, the solder particles will be squeezed out of the gold containing particles outside the welding area at the same time, During melting, if it cannot return to the welding area, retained solder balls will also be formed.
Because of its small size, multiple gears, uniform driving force and good paragraph feeling, it is widely used in many fields such as household appliances. With the continuous improvement of people's living standards, the upgrading of these household appliances is faster and faster, and the number of them will be larger and larger, which is also the greatest potential direction for us to be optimistic about its development prospects.
